Welcome to the new KDT JU project
The HiCONNECTS project develops the next generation of electronic components and systems heterogeneous integration core technology solutions for energy-efficient, high-performance wireless/wired cloud and edge computing and automotive radar in support of the next radio frequency and IT technology evolution.
The Mission
The HiCONNECTS project will enable both wired/wireless networks and edge/cloud data centers of the future to operate with high performance and reliability, increasing overall energy efficiency. Likewise, the project will enable enhanced sensing capabilities for radars by supporting parallel technology and packaging integration, allowing increased link budget and bandwidth while reducing the Bill of Material cost for the overall system.
Start: 1 January 2023 | Duration: 36 months
HiCONNECTS represented at APMC Conference
We were delighted to see that many of our consortium members presented their research at the APMC Conference in Hamburg [...]
Period 1 Review Meeting in Brussels
HiCONNECTS Consortium members met at the White Atrium building, home to Chips Joint Undertaking, on April 4-5 2024, to present [...]
HiCONNECTS Consortium Meeting Update
The HiCONNECTS 12-Month Consortium Meeting took place in Catania last week at the offices of STMicroelectronics Italy. The meeting featured [...]
Standards Workshop at SEMICON Europa
A HiCONNECTS Standards Workshop was held at SEMICON Europa in Munich in November. This was led by Ilan Englard, the [...]
HiCONNECTS presentations at SEMICON Europa
We were delighted to see the presence of HiCONNECTS at SEMICON Europa. Four of our esteemed consortium members spoke at [...]
HiCONNECTS at SEMICON Europa
The HiCONNECTS project will feature at SEMICON Europa with presentations at the EU Digital Future Forum and a Standards Workshop. [...]
The Consortium
